News
How Femtosecond Lasers Process Metals, Polymers, Glass, and Ceramics
2026-09-12
Explore how femtosecond lasers process metals, polymers, glass, and ceramics through precision micromachining with minimal thermal impact and high repeatability.
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When to Use Femtosecond Laser Machining, and When Not To
2026-09-04
Learn when femtosecond laser machining is worth using—and when conventional lasers are the better choice—based on tolerance, heat sensitivity, defect risk, and production volume.
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How to Control Femtosecond Laser Drilling Taper
2026-08-21
How to control taper in femtosecond laser drilling: choose the right geometry, account for material, and specify it on a drawing.
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Meet MONO at Laser & Photonics Taiwan 2026
2026-08-12
Join MONO at Laser & Photonics Taiwan 2026, August 19-22, at Taipei Nangang Exhibition Center, Booth P1004, to explore our femtosecond laser micromachining!
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Femtosecond Laser Precision Turning: A Practical Guide
2026-08-07
Explore femtosecond laser precision turning technology, from its working principle and key benefits to material capabilities and applications in semiconductor, medical, and precision manufacturin...
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Femtosecond Laser Drilling Taper: Zero, Positive & Negative
2026-07-30
Learn the differences between positive, zero, and negative taper in femtosecond laser drilling. Discover what causes each taper geometry, how helical drilling and trepanning control hole shape, a...
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Femtosecond Laser Machining of Internal Serrated Apertures in Circular Substr...
2026-07-23
MONO's femtosecond lasers cut internal serrated apertures in 0.05mm stainless steel, holding corner radii to 2μm.
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Molybdenum Aperture Machining: Burr-Free Precision with Femtosecond Lasers
2026-07-17
See how femtosecond laser machining produces burr-free molybdenum apertures with tight hole tolerances and no heat-affected zone, for electron microscopy, X-ray, and semiconductor applications.
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MONO Delivers Custom Femtosecond Laser System to South Korea
2026-07-14
MONO has delivered a customized femtosecond laser system to South Korea, supporting high-precision semiconductor micromachining with burr-free processing and 5-axis helical drilling.
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