Meet MONO at Laser & Photonics Taiwan 2026
MONO will exhibit at Laser & Photonics Taiwan 2026, held August 19 to 22 at the Taipei Nangang Exhibition Center in Taipei. At Booth P1004, our team will present femtosecond laser micromachining solutions for semiconductor, medical, electronics, and advanced materials manufacturers, along with real production samples and technical consultations on-site.
Laser & Photonics Taiwan is Taiwan's leading annual laser and photonics exhibition, held at the Taipei Nangang Exhibition Center and organized by Chan Chao International Co., Ltd. It draws laser, precision machining, and automation suppliers serving the semiconductor, EV, biomedical, and aerospace industries.
MONO's team will be on-site throughout the show, with real production samples and application specialists ready to review your project details in person.
| Details | Info |
|---|---|
| Event | Laser & Photonics Taiwan 2026 |
| Dates | August 19-22, 2026 (Wed-Sat) |
| Show Hours | 10:00 AM - 5:00 PM (4:00 PM on August 22) |
| Venue | Taipei Nangang Exhibition Center, Hall 2, 1F |
| Address | No. 2, Jingmao 2nd Rd., Nangang District, Taipei, Taiwan |
| Booth | P1004 |
At Booth P1004, we will demonstrate three core femtosecond laser processes behind MONO's precision manufacturing services.
Femtosecond pulses remove material through cold ablation rather than melting, which limits heat input and avoids the recast layers typical of longer-pulse processes. This lets MONO machine hole diameters from 3μm to 100μm, with positioning accuracy of ±1μm, in materials up to 2mm thick, spanning metals, plastics, and ceramics.
Taper control is usually the harder problem. Laser beams naturally narrow as they penetrate a material, so most drilling methods leave holes wider at the entry than at the exit. Through beam shaping and path optimization, MONO can hold zero taper, or shape a hole positive or negative on purpose, whichever the application calls for, at aspect ratios up to 10:1. This matters most where taper affects function rather than appearance: probe card microholes with chamfer radii as tight as 4μm, spinneret nozzles for fiber production, and fluid or gas channels where flow rate depends on a consistent bore diameter.
Unlike mechanical or long-pulse laser cutting, MONO's femtosecond process vaporizes material directly through cold ablation rather than melting it first. There is no molten pool to leave burrs or microcracks along the edge, and heat has too little time to spread into the surrounding structure before the beam moves on. Mechanical stress and thermal deformation stay minimal, even on delicate, ultra-thin, or heat-sensitive materials.
Cutting trajectories range from simple straight lines to complex contours, across metals, high-molecular polymers, and composite materials that other laser or mechanical methods struggle to cut cleanly, including tungsten-molybdenum diaphragms and beryllium copper probes. In demanding cases, such as producing zero-taper slits down to 15μm for mass spectrometer components, precise angle control becomes the deciding factor, improving instrument throughput without sacrificing resolution.
Explore Cutting Capabilities →
Beyond cutting and drilling, femtosecond lasers create functional micro-textures on flat or curved surfaces, controlling friction, wettability, or optical behavior without a separate finishing step. MONO processes micro-features as small as 10μm, holds sidewall verticality even at a 1:1 aspect ratio, and finishes surfaces to Ra≤0.2μm with no craters or burrs.
Because the process runs cold, there is no recast layer, molten residue, or carbonization, whether the workpiece is a metal such as copper or an insulating dielectric such as PI, LCP, or FR4. That makes it suitable for blind holes and enclosed structures, where heat damage would otherwise be trapped and impossible to inspect or correct afterward. Typical work includes light guide plate microstructures, bearing and gear surface texturing for reduced friction, and mold cavities for optics and cosmetics manufacturing.
Femtosecond laser micromachining supports demanding applications across several industries.
- Semiconductor. ESC mesa structures, probe card apertures, and wafer-level micro-features benefit from femtosecond processing's minimal heat input and micron-level accuracy.
- Medical. Catheters, microneedles, and interventional device components require clean, burr-free cuts with tight tolerances, which cold ablation delivers without secondary finishing.
- Advanced Materials. Tungsten, molybdenum, sapphire, technical ceramics, and other hard or brittle materials can be processed without cracking, chipping, or the recast layers common with other laser types.
MONO also supports projects that are still in development, from early feasibility work through production-ready processes.
- Feasibility Study. Send drawings or CAD files for a technical review of whether femtosecond processing fits your part, material, and tolerance requirements. Start a Feasibility Study →
- Sample Processing. Small batches of test parts can be produced to validate quality and function before committing to a full production run. Sample and Small-Batch Production →
- Equipment Solutions. For manufacturers who need in-house capability, MONO also supplies femtosecond laser systems and custom configurations. View Laser Machines →
Bring your drawings, samples, or open questions to Booth P1004 between August 19 and 22. Our engineers will be available throughout the show to discuss feasibility, review specifications, and walk through sample parts. To schedule a meeting in advance, contact our team or reach out via WhatsApp at +852 5685 8560.