5-axis femto laser machine for Complex Micro Drilling

ML-VORTEX is a 5-axis femtosecond laser machine engineered for complex micro-drilling, pushing the boundaries of special-shaped micro hole processing. It is designed to deliver unparalleled micro-drilling solutions for the most demanding industrial applications.

This machine efficiently processes a wide variety of materials, including metals, polymers, glass, and ceramics, enabling the creation of precise micro-holes on complex curved surfaces.Its capabilities extend to various geometries such as round, square, and triangular holes, ensuring no heat-affected zones, burr-free results, and exceptional edge quality.The ML-VORTEX is highly versatile, making it ideal for precision manufacturing in the medical, aerospace, electronics, and automotive industries.

❑Aerospace Precision Component Drilling

❑WatchmakingIntricate Parts Manufacturing

❑Semiconductors Micro-Holes for Probe Cards

❑Advanced Materials Custom-Shaped Holes for Spinneret Plates

Products Features

Industrial-Grade Customizable femtosecond Laser Source
Multi-Dimensional Beam Shaping and Control Capabilities
Real-Time Monitoring of Beam Pointing and Quality
Superior Mechanical and Thermally Stable Base Platform
High-Dynamic Response, Multi-Functional Control System
Fully Sealed Beam Delivery and Optical Path System
Coordinated Multi-Axis Precision Machining for 3D Surfaces
Comprehensive 3D Collision Avoidance System

Products Highlights

Precision Machining & Quality

❑Micron-Level Accuracy: Guarantees exceptional feature fidelity with a positioning accuracy of ≤±1μm (X/Y/Z) and rotational accuracy of ≤±3 arcsec (C-axis).

❑Sharp & Defined Contours: Produces complex geometries with a corner radius (R-angle) as fine as ≤4μm.

Advanced Micro-Hole Manufacturing

❑High-Precision Holes: Achieves a hole diameter precision of ≤±1μm within a Ø0.02mm to 2.5mm range，high roundness.

❑High Aspect Ratio: Capable of producing micro-holes with a maximum depth-to-diameter ratio of 12:1.

❑Zero Taper Capability: Ensures highly vertical hole walls with a taper control precision of ≤±1μm.

Superior Surface Integrity

❑Smooth, Burr-Free Walls: The femtosecond laser's "cold ablation" process yields exceptionally smooth interior surfaces.

❑No Heat-Affected Zone: Eliminates recast layers and micro-cracks, preserving the material's original structural and chemical properties.

Flexible & Efficient Production

❑Versatile Material Processing: Compatible with a wide range of materials, including metals, ceramics, glass, and polymers.

❑One-Step Forming: Manufactures complex features like straight through hole, blind hole，or composite holes in a single, efficient process.

Technical specifications

Parameter	Details
Laser Source	Femtosecond laser（1030/515nm）
Processing Range	Planar: 400mm×400mm；Stereo: 200mm×200mm×150mm
Positioning Accuracy (X/Y/Z/B/C)	≤±1μm/≤±1μm/≤±1μm/≤±5arcsec/≤±3arcsec
Processing Types	Straight holes, taper holes, countersinks, composite holes, etc.
Max Processing Depth	2mm
Max Depth-to-Diameter Ratio	12:1
Hole Diameter Range	0.02mm~2.5mm
Hole Diameter Precision/Concentricity	≤±1μm / ≤1.5μm
Taper Control Precision	≤±1μm
Counterbore Chamfer R	≤4μm