High-Speed Laser Micro-Hole Drilling Machine | 2,000 Holes/Sec

Designed for the extreme demands of mass production, this High-Speed Femtosecond Laser Drilling Machine redefines efficiency and precision. It specializes in processing high-density micro-hole arrays on thin-walled metals and curved surfaces.

Capable of drilling up to 2,000 holes per second, this system ensures exceptional consistency and a guaranteed through-hole rate of >99%. It is the ultimate solution for processing difficult-to-machine materials, including Stainless Steel, Titanium Alloys, and High-Temperature Superalloys.

Products Applications

Filtration & Separation: Precision filter screens, micro-sieves, and porous metal foils.
Automotive: GDI fuel injector nozzles (group holes), oil control valves.
Sensors & Electronics: Sensor housings, acoustic components, and breathable membranes.
Aerospace: Cooling holes for turbine components and thin-walled heat shields.

Products Features

3D Curved Surface Processing

❑Integrated with a high-precision 3-axis control system and beam scanning module, the machine supports complex micro-hole forming on irregular 3D surfaces (e.g., nozzle tips or sensor domes).

Flexible Taper Control

❑ The high-speed beam scanning system allows for flexible trajectory control. It can precisely fabricate Taper holes to meet specific flow dynamics requirements.

Real-Time Focus Compensation

❑ Equipped with a high-precision laser rangefinder and proprietary algorithms, the system automatically compensates for focal length variations in real-time, ensuring consistent hole quality across uneven surfaces.

Precise Depth Control

❑ Advanced power modulation allows for exact control of material removal per pulse, enabling high-precision blind hole drilling with controlled depth.

Highlights

Extreme Speed

Achieves drilling speeds of up to 2,000 holes/second for high-density arrays.
High Yield

Through-hole rate guaranteed > 99%.
Superior Consistency

High pulse energy stability ensures every hole matches the design specifications perfectly.

Technical specifications

Item	Details
Laser	Femtosecond Laser (1030/515/343nm)
Processing Area	350mm×350mm（Customisable）
Positioning Accuracy (X/Y/Z)	±2μm/±2μm/±5μm
Processing hole aperture range	0.06mm~0.5mm
Repositioning Accuracy (X/Y/Z)	±1μm/±1μm/±3μm
CCD positioning accuracy	±4.7um @130Megapixel
CCD visual range	5mm*6mm
Drilling speed (Max)	2,000 Holes/Sec
Machining thickness (Max)	2mm