Semiconductors & electronics-fs-laser application

Semiconductor & Electronics Micromachining

The semiconductor industry represents the pinnacle of modern manufacturing, demanding absolute precision, consistency, and material versatility. Traditional machining methods often fail to meet the stringent requirements of high-end components due to thermal distortion and precision limits.Femtosecond laser technology opens a new path for advanced semiconductor manufacturing.

Gas Distribution Plate (Showerhead) Drilling

The Gas Distribution Plate (Showerhead) is critical in Etching and Deposition (CVD/PVD) equipment. Its micro-hole quality directly dictates wafer process uniformity，requiring thousands of flaw-free micro-holes on a single plate.

Our Technological Breakthroughs:

Ultra-Fine Holes: Capable of drilling vertical micro-holes as small as 20μm.

Extreme Precision: Achieves ±1μm hole diameter accuracy with superior consistency across high-volume arrays.

Thin-Wall Integrity: Maintains structural integrity even with 15μm wall thickness, ensuring no merged or broken holes.

Material Versatility: Perfectly suited for metals (Aluminum, Stainless Steel) and hard-brittle materials like Silicon Carbide (SiC), Ceramics, and Silicon, eliminating chipping issues.

Semiconductor Testing & Probe Cards

In semiconductor testing, Beryllium Copper (BeCu) is widely used for probe cards and lead frames. Traditional stamping or long-pulse lasers often cause warping, compromising test stability.

Femtosecond Laser Cutting Advantages:

Stress-Free Cutting: "Cold ablation" prevents thermal warping, ensuring absolute flatness for stable probe-to-pad contact.

Edge Quality: Delivers smooth, burr-free, and slag-free edges, preserving the mechanical and electrical properties of BeCu.

Micron-Level Control: Dimensional accuracy is maintained within 2μm, meeting the needs of high-density probe arrays.

More Electronics Applications

Precision cutting of complex characters and patterns with ultra-fine linewidths and no deformation.

Cutting of Interdigitated Electrodes (IDEs) and micro-structuring of Wire Bonding Capillaries.

Blind hole drilling in Copper Clad Laminates (CCL) and carbonization-free cutting of conductive cloth.

Why Femtosecond Laser?

Femtosecond laser technology is the future of semiconductor precision manufacturing.

One-Step Manufacturing: Eliminates the need for deburring or post-cleaning, significantly shortening R&D and production cycles.

Non-Destructive: Minimal Heat Affected Zone (HAZ) prevents recast layers and micro-cracks, preserving intrinsic material properties.

Flexible Production: Enables rapid customization through software control. Ideal for high-mix, low-volume production and fast response to iterating chip designs.