Semiconductors & electronics-fs-laser application

Universities & R&D Centers

Exploring matter at the micro and nano scales is at the frontier of modern science. Femtosecond lasers, with their ultra-short pulses (10⁻¹⁵s) and high peak power, enable non-contact "Cold Ablation" on virtually any material.

We provide flexible, high-precision micro-nano fabrication solutions for Universities and R&D Centers. Whether for studying processing mechanisms or Micro-Device Prototyping, our technology breaks limitations, empowering cross-disciplinary innovation.

Research Frontiers

1. Laser-Matter Interaction

Researchers can compare ablation thresholds between femtosecond, picosecond, and nanosecond pulses, investigating hole formation mechanisms under various energy densities to generate robust data for high-impact publications.

2. Surface Functionalization

Femtosecond laser systems enable precise modification of surface structures and textures. This allows for the creation of micro-nano textures on metals, glass, or polymers to achieve Superhydrophobic, Superhydrophilic, anti-icing, anti-reflective, or cell-adhesion properties.

3. Rapid Micro-Device Prototyping

Overcome the high costs and complexity of photolithography. Our maskless, direct-write process works on Silicon, Ceramics, and Thin Films. It is widely used for the rapid prototyping and iteration of MEMS sensors, Microfluidic Chips, masks, and photoelectrodes.

Lab-Grade Capabilities

1. Ultra-Fine Micro-Drilling

We break through traditional limitations to achieve an Aspect Ratio of up to 10:1. With a minimum diameter of 3-5μm, our process ensures high roundness and consistency. It supports positive taper, negative taper, zero-taper straight holes, and various shaped holes.

2. Damage-Free Precision Cutting

For fragile foils and micro-mechanical structures, femtosecond laser cutting ensures smooth, burr-free edges with no thermal deformation. With a minimum kerf/rib width of just 5μm, it is perfect for the stress-free cutting of metal masks and precision components.

3. Depth-Controlled Etching

Capable of micron-level depth control, we enable the precise etching of blind slots, surface micro-bosses, and selective film removal. Typical applications include 25μm square hole arrays and serpentine electrode patterns, ideal for Integrated Circuits (IC) and microelectronics research.

Why Partner With Us?

One system for the entire laboratory. From hard ceramics and diamonds to heat-sensitive polymers and biological tissues, femtosecond lasers handle it all.

We provide more than just equipment; we support the full workflow—from sample testing to process verification—accelerating your path to new scientific discoveries.

Application Examples

10cm Linear Encoder Groove Etching | Depth: 20μm±1μm

Quadrant Plate | Material：Tungsten；Sharp Angle：40°；Sharp Angle Length：40μm ± 2μm

Cell Sorting Device fs-laser micromachining：119.5°

cell-adhesion properties microstructure by fs-laser

Platinum-Iridium Alloy Surface Microstructure：Etching Depth：7μm±0.5μm Etching Width：5μm±0.5μm

Complex Shape Micro-Electrode Cutting：Stainless Steel，Thickness：0.01mm，Cutting Width：5μm ± 0.5μm

GaN Etching：Crack-free & Chip-free

fs-laser slits cutting | width：5μm

fs-laser slits cutting | width：2μm

Linear Encoders Groove Etching | width：4μm±1μm

Micro-Mechanical Structure Cutting | Tungsten，Cutting Width：6μm ± 0.5μm，Thickness：0.05mm

Profiled Micro-Electrode Cutting | Stainless Steel；min. width: 6.5μm

Sharp Internal Angle Cutting | Tip width：6μm

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Contact information

Address

F1-F2, Building 4, Jianfa-Xinmei Industrial Park, No. 21 Gongtang Road, Guangming District, Shenzhen, China.

Email: laser_ops@szmono.cn
Phone: +85256858560