ML-EDGE: Femtosecond Laser Clean Micro Tube Cutting Equipment

In high-end fields such as interventional medical care and precision electronics, the quality of each cut is directly related to the final performance and safety of the product. ML-EDGE is a femtosecond laser precision cutting platform specially designed for medical-grade and industrial-grade micro tubes. It fills the industry's technical gap in "non-damaging, high-precision, and fully clean" processing scenarios, and is a powerful tool for high-quality continuous processing of thin metal and polymer tubes.

The equipment integrates targeted optical path transmission design, high-precision motion system and independently developed clamping technology, aiming to provide a stable, efficient and extremely clean cutting solution.

❑ Interventional Medical Device Precision Processing

❑ Surgical Instrument Precision Processing

❑ Endoscope Snake Bone Tubes & Other Precision Processing

❑ Precision 3C Structural Components

❑ Automotive Parts

❑ Semiconductor Integrated Circuits

Products Features

High-quality industrial-grade fs -laser customizable light source;
Multi-dimensional beam shaping and control functions;
Excellent mechanical and thermal stable equipment base;
High dynamic response multi-axis control system;
Fully sealed optical path transmission system structure;
Multi-axis linkage precision processing;
Small cutting taper, high efficiency;
Minimal thermal impact on end faces, smooth surface, no burrs.

Products Highlights

Clean Cut, Strict Tolerance and Taper Control

❑ Precision: ±1μm

❑ Burr-free cut, precise control of width and taper

Excellent Cutting Quality, No Post-Processing Required

❑ Roughness Ra≤0.2μm

❑ No surface damage, no recast layer

Material Non-Selectivity, Stress-Free Processing

❑ Supports polymer materials such as polyimide

❑ No carbonization, no burrs, no damage to the opposite wall structure

One-Step Forming of Complex Geometric Shapes

❑ Tube drilling, cutting, shape customization

❑ Neat cut, no recast layer, no micro-cracks

Technical specifications

Item	Details
Laser	Femtosecond Laser (1030/515nm)
Processing Area	Pipe Diameter: Φ0.1-Φ20mm±0.02mm; Length: ≤1000mm
Positioning Accuracy (X/Y/Z/θ)	≤±1μm/≤±1μm/≤±1μm/≤±15arcsec
Cutting Thickness	≤1mm
Cutting Slit Width	≥15μm
Minimum Width	≤15μm
Taper	≤20μm@0.5mm Thickness
Cutting Surface Roughness	≤Ra0.4
Cutting Accuracy	≤±2μm