ML-ETCH_ Microstructure & Microtexture Etching for Curved Surfaces-mono.jpg

ML-ETCH_ Microstructure & Microtexture Etching for Curved Surfaces.jpg

ML-ETCH: Microstructure & Microtexture Etching for Curved Surfaces

In highend fields like semiconductors, optical instruments, and biomedical devices, product innovation is advancing into the microscale. A key technical bottleneck for industrial upgrading is achieving non-damaging, high-efficiency, and high-precision 3D micro-engraving on high-melting-point, high-hardness, and high-value materials. Mono’s ML-ETCH offers the solution.

It integrates self-developed industrial-grade femtosecond laser technology and advanced motion control systems. Maximizing the "non-damaging" processing advantage, it is specifically designed for microstructure forming and precision etching on flat and complex curved surfaces. It breaks through material and shape limitations, turning complex micro-designs into reality and strongly supporting product innovation.

❑ Microstructure Forming & Curved Surface Etching

❑ Irregular microstructure of light guide plate

❑ Semiconductor special-shaped probe etching

❑ Deflector microchannel forming

❑ Ultra-fine texture processing

Products Features

High-quality industrial-grade fs-laser customizable light source;
Three-dimensional beam shaping and control functions;
Excellent mechanical and thermal stable equipment base;
High dynamic response multi-function control system;
Fully sealed optical path transmission system structure;
Multi-axis curved surface precision processing;

Products Highlights

Submicron Precision Microstructure Forming

❑ Compatible with metals (stainless steel, copper alloys, tungsten, molybdenum, gold - platinum alloys, etc.). Enables micron - level grooving and micro - engraving on curved surfaces. No Heat - Affected Zone (HAZ), no burrs, no recast layers. Surface roughness Ra ≤ 0.2μm. Widely used in molds, rollers, bearings, seals, etc. Batch consistency of processed molds/tools ≥ 99.5%, meeting industrial mass production needs.

Selective Thin Film Removal with Zero Thermal Damage

❑ Leverages femtosecond laser’s "cold processing" and non - contact features. Enables precise thin film peeling without substrate thermal damage or edge burrs. Suitable for selective removal of conductive/dielectric layers on heat - sensitive substrates (e.g., piezoelectric components, flexible circuits) and microfluidic chip manufacturing.

Surface Functional Microtexture Processing

❑ Custom microtexture designs. Endows materials with functions: friction reduction, hydrophobicity/hydrophilicity, soft touch, anti - glare.

Wide Material Compatibility

❑ Solves the pain point of "hard materials being hard to etch and prone to chipping". Compatible with hard brittle/high thermal conductivity materials (polycrystalline diamond/PCD, sapphire, tungsten carbide, etc.). Widely used in optical components, wear - resistant tools, semiconductor masks, etc.

Technical specifications

Processing Area	Planar: 400mm×400mm; Stereo: 150mm×150mm×100mm
Positioning Accuracy (X/Y/Z/B/C)	≤±1μm/≤±1μm/≤±1μm/≤±5arcsec/≤±3arcsec
Workpiece Type	Planar, Curved Surface
Minimum Line Width	3μm
Surface Roughness	≤Ra0.2
Dimensional Accuracy	≤±2μm
Depth-to-Diameter Ratio Accuracy	≤±0.3μm
Comprehensive Processing Accuracy	≤±3μm