Contact 
Leave Your Message

ML-NEBULA: Femtosecond Laser Nanostructure Multi-Beam R&D Equipment

Every scientific breakthrough stems from the challenge of limits. In the world of microns, submicrons and even nanometers, the precision of tools defines the depth of exploration. MONO helps every scientist and engineer stay ahead in research, using the most advanced femtosecond laser micromachining technology to accurately turn your ideas into reality.

ML-NEBULA is a femtosecond laser nanostructure multidimensional R&D equipment specially designed for multi-functional and high-precision R&D. It is an ideal choice for scientific laboratories and R&D centers that need to switch between various tasks and pursue extreme precision and flexible solutions. The equipment provides nanoscale micromachining capabilities, from surface treatment to internal direct writing, from prototype production to small-batch production, all can be completed with one machine.

❑ Functional Surface Micro-Nano Structure Fabrication

❑ Optical Waveguide Direct Writing Processing

❑ Microfluidic Chip Fabrication

❑ Nanoscale Linewidth Grating Lithography

❑ Slit Diaphragm/Aperture Diaphragm Processing

    Products Features

    • Industrial-Grade Customizable femtosecond Laser Source (2)

      Support multi-optical path and multi-focus composite processing;

    • Multi-Dimensional Beam Shaping and Control Capabilities

      Multi-dimensional beam shaping and control functions;

    • Real-Time Monitoring of Beam Pointing and Quality

      24/7 beam directivity and quality detection;

    • Superior Mechanical and Thermally Stable Base Platform

      Excellent mechanical and thermal stable equipment base;

    • High-Dynamic Response, Multi-Functional Control System

      Processing precision covering nano, sub-micron and micron scales;

    • Fully Sealed Beam Delivery and Optical Path System

      Nanojoule-level pulse energy precise control system;

    • Coordinated Multi-Axis Precision Machining for 3D Surfaces

      Nanoscale positioning accuracy;

    • Comprehensive 3D Collision Avoidance System

      Multi-axis linkage precision processing.

    Products Highlights

    image

    Functional Surface Micro-Nano Structure Preparation

    Used to develop surface micro-nano structures with special optical (such as metalenses, polarization control), mechanical (such as superhydrophobic, self-cleaning), and electrical (such as flexible electrodes, sensors) properties.  It supports cutting-edge research in fields like materials science and interface engineering.
    image

    Optical Waveguide Direct Writing: Microfluidic Chip Manufacturing

    ❑ Creates 3D optical path structures inside transparent materials like glass and crystals.  Suitable for R&D of photonic integrated chips and optical fiber sensors, as well as precision processing of microchannels, mixers and reaction chambers in microfluidic systems.
    image

    Nanoscale Line Width Grating Writing

    ❑ Develops next-generation optical instruments (such as spectrometers, grating sensors) and information storage devices (such as nanoscale storage units).  Realizes high-precision writing of nanoscale line width gratings, breaking through the resolution limit of traditional processing technologies.
    image

    High-Precision Slit/Diaphragm Processing

    ❑ Provides high-precision slit and diaphragm components for optical systems (such as lithography machines, microscopes) and precision instruments (such as particle detectors), ensuring the performance stability and precision consistency of optical devices.

    Technical specifications

    Item

    Details

    Laser

    Femtosecond Laser (1030/515/343nm)

    Processing Area

    500mm×500mm

    30mm×30mm

    Positioning Accuracy (X/Y/Z)

    <±0.3um/<±0.3um/<±1um

    <±0.15um/<±0.15um/<±0.5um

    Processable Material Types

    Planar, cylindrical, spherical, 3D curved surfaces, etc., customizable combination

    Processing Contents

    Depth-controlled etching, carbon-free cutting, through-hole drilling, nanomanufacturing, etc.,
     customizable combination

    Minimum Hole Diameter

    ≥500nm ,customizable as required

    Minimum Processable Line Width

    ≥300nm,customizable as required

    Processable Hole Diameter Range

    ≥200nm,customizable as required

    Hole Diameter Precision

    ≥±50nm ,customizable as required

    Application Examples

    15μm Mass Spectrometer 0-Taper Slit Cutting

    15μm Mass Spectrometer 0-Taper Slit Cutting

    MONO Grating Direct Writing

    MONO Grating Direct Writing:line Width 0.449μm

    For microfluidic chips (Lab-on-a-Chip), our ML-NEBULA equipment not only etches channels on glass surfaces but also supports laser direct wr (

    MONO Microfluidic Chip Microchannel Etching

    Mono Submicron Drilling

    Mono Submicron Drilling: 148nm holes

    01

    contact us

    Start a Conversation

    Ready to solve your precision challenges? Fill out the form below and our team will respond within 24 hours.

    Contact information

    Address

    F1-F2, Building 4, Jianfa-Xinmei Industrial Park, No. 21 Gongtang Road, Guangming District, Shenzhen, China.

    1647831b1f9f653d5ce88b0294a12170
    yx-contact-bg