ML-TRACK: Femtosecond Laser Burr-Free Precision Cutting Equipment

ML-TRACK is a "precision cutting expert" to tackle extreme material processing challenges. It is specifically designed for high-end manufacturing scenarios with strict requirements on processing accuracy, thermal impact control, and material compatibility.

Its core lies in the revolutionary femtosecond laser micro-cutting technology: using ultra-short pulses at the femtosecond level as a "light blade", which instantly vaporizes and sublimes when contacting materials, completely eliminating the possibility of heat transfer.

This results in a perfect cutting edge with almost no heat-affected zone - no melting, no burrs, no micro-cracks, and fully retains the original physical properties of the material. Whether it is ultra-hard tungsten-molybdenum, brittle silicon-based, or heat-sensitive polymer films, ML-TRACK transforms your complex designs into perfect parts with micron-level precision.

❑ Precision Cutting of Thin Metal & Non-Metal Sheets

❑ Tungsten/molybdenum diaphragms and slit diaphragms

❑ Precision cutting of beryllium copper probes

❑ PI/PET blind holes, through holes, and dense hole clusters

❑ Silicon-based drilling and grooving

Products Features

High-quality industrial-grade femtosecond customizable light source;
Excellent mechanical and thermal stable equipment base;
Multi-function motion and laser control system;
Fully sealed optical path transmission system structure;
Suitable for high-speed cutting of any organic & inorganic materials;
Enables precision processing of almost any solid material.

Products Highlights

Submicron-Level Cutting Precision

❑ Suitable for high-hardness materials such as tungsten and molybdenum

❑ Minimum line width 3μm

❑ Precision ±1μm

Excellent Cutting Surface and Edge

❑ Almost no thermal impact and no cracks

❑ Cutting surface roughness Ra≤0.1μm

❑ High-gloss side walls

One-Step Forming of Geometric and Sharp-Angle Shapes

❑ No burrs and no carbonization

❑ Customization of sharp angle and arc cutting trajectories

❑ Extremely high roundness

Extremely Fine Contours and Line Widths

❑ No deformation and clear edges

❑ Fine details and repeatable processing effects

Technical specifications

Item	Details
Laser	Femtosecond Laser (1030/515/343nm)
Processing Area	400mm×400mm
Positioning Accuracy (X/Y/Z)	≤±1μm/≤±1μm/≤±1μm
Workpiece Type	Planar
Minimum Line Width	≥3μm
Surface Roughness	≤Ra0.1
Dimensional Accuracy	≤±0.5μm
Depth-to-Etching Depth Accuracy	≤±0.1μm
Comprehensive Processing Accuracy	≤±3μm