ML-VORTEX: Femtosecond Laser Trepanning & Zero-Taper Micromachining Center

ML-VORTEX is a compact, industrial-grade 5-axis laser machining center specifically engineered for rotationally parts and complex 3D surfaces.

Moving beyond traditional percussion drilling, the ML-VORTEX utilizes advanced laser trepanning (helical drilling) optics. By precisely controlling the beam's orbital motion and angle of incidence via 5-axis linkage, it achieves True Zero-Taper holes and high-precision contouring. This machine offers a seamless combination of drilling, etching, and cutting, supported by deep system integration for real-time monitoring and high-efficiency production.

Capabilities

The Ultimate Solution for Zero-Taper Micro-Drilling

The ML-VORTEX pushes the boundaries of special-shaped micro-hole processing. It is designed to deliver unparalleled solutions for the most demanding industrial applications, particularly where hole geometry and wall verticality are critical.
Trepanning & Helical Drilling

Unlike static beams, our vortex-style trepanning eliminates the "V-shape" taper inherent in traditional laser processing, creating perfectly cylindrical or customized inverse-taper holes.
5-Axis Linkage for Curved Surfaces

Enables the laser head to maintain a perfect perpendicular angle to any point on a curved surface, ensuring consistent hole quality on injector nozzles, sensor domes, and medical implants.
Material Versatility

Efficiently processes metals, polymers, glass, and ceramics with no heat-affected zones (HAZ).

Products Features

Industrial-Grade Customizable femtosecond Laser Source

5-Axis Coordinated Trepanning

Synchronized control of mechanical axes and optical scanners for precision helical drilling on 3D surfaces.

Industrial-Grade Customizable femtosecond Laser Source (2)

Industrial-Grade Femtosecond Source

High-stability source customizable for specific pulse duration and energy needs.

Multi-Dimensional Beam Shaping and Control Capabilities

Real-Time Process Control

Integrated monitoring of beam pointing and quality ensures stability during long machining cycles.

Real-Time Monitoring of Beam Pointing and Quality

High-Dynamic Response

Multi-functional control system designed for high-speed, complex trajectory execution.

Superior Mechanical and Thermally Stable Base Platform

Thermally Stable Platform

Superior granite base and fully sealed optical path guarantee micron-level stability.

Coordinated Multi-Axis Precision Machining for 3D Surfaces

3D Collision Avoidance

Comprehensive safety system for complex multi-axis operations.

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Products Features

Zero-Taper & Geometry Control

❑Zero Taper Capability: Achieves highly vertical hole walls with taper control precision of ≤±1μm. It can produce Straight, Positive, or Inverse (Negative) taper holes on demand.

❑Advanced Trepanning: The helical drilling method ensures high circularity and enables the creation of non-round shapes (square, triangular) with sharp contours.

Micron-Level Precision

❑ Positioning Accuracy: ≤±1μm (X/Y/Z axis).

❑ Rotational Accuracy: ≤±3 arcsec (C-axis) for precise indexing of rotationally symmetric parts.

❑ Sharp Contours: Produces complex geometries with a corner radius (R-angle) as fine as ≤4μm.

High-Quality Micro-Hole Manufacturing

❑ Hole Precision: Diameter precision of ≤±1μm within a range of Ø0.02mm to 2.5mm.

❑ High Aspect Ratio: Capable of producing micro-holes with a depth-to-diameter ratio up to 12:1 without sacrificing wall verticality.

❑ Superior Wall Quality: The "cold ablation" process yields smooth, burr-free interior surfaces with No Heat-Affected Zone, preserving material integrity.

Flexible & Efficient Production

❑ One-Step Forming: Manufactures complex features like straight through-holes, blind holes, or composite step-holes in a single automated process.

❑ Broad Compatibility: Ideal for precision manufacturing in Medical , Aerospace , Electronics, and Automotive.

Technical specifications

Parameter	Details
Laser Source	Femtosecond laser（1030/515nm）
Processing Range	Planar: 400mm×400mm；Stereo: 200mm×200mm×150mm
Positioning Accuracy (X/Y/Z/B/C)	≤±1μm/≤±1μm/≤±1μm/≤±5arcsec/≤±3arcsec
Processing Types	Straight holes, taper holes, countersinks, composite holes, etc.
Max Processing Depth	2mm
Max Depth-to-Diameter Ratio	12:1
Hole Diameter Range	0.02mm~2.5mm
Hole Diameter Precision/Concentricity	≤±1μm / ≤1.5μm
Taper Control Precision	≤±1μm
Counterbore Chamfer R	≤4μm