Manufacturing World Japan 2026
Manufacturing World Tokyo is Asia’s leading manufacturing exhibition with over 30 years of history.
As the premier gateway to Japan’s industrial market, it brings together 10 specialized exhibitions under one roof, driven by Industry 4.0.
The event serves as a major hub for advanced manufacturing, with strong focus on femtosecond laser processing, ultra-precision machining, and 3D printing.
It attracts over 2,000 global exhibitors and 70,000+ professionals — the ideal platform to source next-generation laser equipment and explore contract manufacturing solutions.
Dates: July 1 (Wed) - July 3 (Fri), 2026
Venue: Tokyo Big Sight, Japan
Booth : East Exhibition Halls
Why Visit Booth E28-55?
Discover how we deliver sub-micron precision that pushes the boundaries of advanced manufacturing.
Bring your most demanding challenges to our booth in Tokyo.
Bring Your Most Challenging Parts
Have you encountered designs that conventional CNC or standard laser processes couldn’t handle?
Bring your drawings or complex CAD files to Booth E28-55.
Our technical team will sit down with you to explore how femtosecond laser micromachining can solve these challenges — with exceptional precision and zero thermal damage.
Examine Real Production Samples
See the results for yourself. We’ve brought a range of actual production components for you to inspect firsthand.
Pick them up, examine the ultra-precise micro-holes, intricate features, functional surface textures, and complex 3D geometries — and feel the quality directly.
End-to-End Contract Manufacturing
We offer more than individual parts. If you need a reliable partner, we can handle your full sub-assembly and complete product manufacturing needs — from multi-process integration and supply chain management to final testing and packaging.
A seamless, low-risk manufacturing solution in Asia.
Featured Applications & Real Samples
At Booth E28-55, see real solutions to difficult manufacturing challenges. Pick up and inspect our femtosecond laser-machined samples yourself.
Inkjet & Filter Sieves Drilling
Challenge: Traditional micro-electroforming methods could only achieve limited aspect ratios (around 1:2), which compromised fluid pressure resistance.
Solution: We applied high-speed, non-contact femtosecond “cold ablation” drilling on thick foil substrates to create clean, stress-free micro-hole arrays.
Spinneret Nozzle Micro-Drilling
Challenge: Conventional EDM processes left tapered holes and microscopic burrs, leading to frequent polymer melt clogging and fiber breakage.
Solution: Using 5-axis linkage and precise beam profile shaping, we can produce complex non-circular profiles (Trilobal, Star-shape, etc.) with perfectly straight walls.
Cosmetic Contact Lens Mold Etching
Challenge: Nanosecond lasers caused molten burrs and recast layers that destroyed the delicate biomimetic textures (starlight/lace patterns) on the molds.
Solution: We use sub-micron ultra-short pulse dry direct-writing on technical ceramics and advanced aluminum molds.
Mass Spectrometer Slit Cutting
Challenge: Standard Gaussian laser beams naturally produce V-shaped tapers and rough edges, causing ion beam scattering and increased noise.
Solution: We integrated Bessel and Flat-top beam shaping optics to precisely control the laser energy profile and create truly perpendicular sidewalls.
Our Core Precision Laser Capabilities
We combine advanced femtosecond laser technology with strong engineering expertise to turn challenging designs into reliable, high-precision parts — consistently and at scale.
Laser Cutting
We specialize in ultra-precise cold ablation cutting that removes material without generating heat-related damage. This allows us to produce clean, stress-free parts even on the most delicate components.
- 15μm ultra-narrow slits for mass spectrometers and analytical instruments
- True perpendicular sidewalls with zero taper
- Completely burr-free and melt-free edges — no secondary processing needed
- Wide material compatibility: ultra-thin foils, polymers, ceramics, sapphire, and more
Laser Drilling
Using advanced beam shaping and optimized processes, we create high-quality micro-hole arrays with excellent control over taper and positioning.
- Hole diameters from 3μm to 100μm for microfluidic applications
- High aspect ratios up to 10:1, ideal for high-pressure micro-sieves
- Positioning and diameter accuracy of ±1μm
- Capable of drilling through materials up to 2.0mm thick
Laser Etching
We create functional sub-micron surface textures on flat or curved surfaces to improve friction, wettability, optical performance, or other critical properties.
- Mirror-smooth surface finish with Ra ≤ 0.2μm
- Fine microstructures down to ≤10μm
- Clean results with no carbonization on metals or dielectrics
- Effective texturing on complex curved surfaces such as precision rollers
Laser Film Stripping
We offer precise, non-contact selective layer removal that protects delicate coatings while preserving the integrity of the underlying substrate.
- Depth control down to ≤0.1μm
- Etching accuracy of ±1μm with clean boundary lines
- Minimum spacing of 3μm, suitable for high-density circuits
- Zero damage to the base substrate
Laser Tube Micromachining
Specialized high-precision processing for medical tubing, including catheters, stents, and microneedles — without tool contact or heat-related risks.
- Micro-tubing cutting down to sub-micron tolerances
- Smooth cuts through wall thicknesses up to 1mm
- Excellent surface quality with Ra ≤ 0.4μm
- Proprietary techniques to prevent back-wall damage
One-Stop Contract Manufacturing
We don’t just provide laser processing — we offer complete manufacturing support from early prototypes to mass production.
- Rapid prototyping with R&D turnarounds as fast as 1–2 hours
- Dedicated production floor with dozens of high-speed laser workstations
- Full in-house metrology using Olympus confocal microscopes (±1μm accuracy)
- Integrated ultrasonic cleaning and turnkey part preparation
Process Specifications
| Process Parameter | Standard Manufacturing Range | Typical Applications & Benefits |
|---|---|---|
| Hole Diameter Range | 3 µm – 100 µm (micro-holes) Up to 20 mm (tubes & contour profiles) |
Inkjet nozzles, micro-sieves, medical catheters, GDI fuel injectors |
| Dimensional Tolerance | ≤ ±1.0 µm | Consistent precision even across large arrays (e.g. probe cards with thousands of holes) |
| Positioning Accuracy | ≤ ±1.0 µm | High accuracy on complex 3D curved geometries through multi-axis processing |
| Maximum Aspect Ratio | 10:1 | Enables high-pressure fluid filtration membranes and deep micro-holes |
| Surface Roughness (Ra) | ≤ 0.2 µm (etching & texturing) ≤ 0.4 µm (tube cutting) |
Mirror-smooth walls that often eliminate the need for post-machining polishing |
| Heat Affected Zone (HAZ) | ≤ 0.2 µm (True Cold Ablation) | "Virtually zero thermal stress, no recast layer, no micro-cracking or carbonization" |
| Maximum Material Thickness | Up to 2.0 mm | Suitable for thick foils, stamping dies, and specialized structural components |
| Material Versatility | Broad compatibility | Metals: Stainless Steel, Nitinol, Pt-Ir, Tantalum, Molybdenum Hard/Brittle: Technical Ceramics, Optical Glass, Quartz, Sapphire Polymers: Polyimide (PI), LCP, FR4, Resin |
Meet Us in Tokyo
Where to find us inside the massive Tokyo Big Sight complex.
Tokyo International Exhibition Center
3-11-1 Ariake, Koto-ku, Tokyo, Japan 135-0063
Exhibition Hall: East Exhibition Hall
Booth Number: E28-55
