MONO Delivers Custom Femtosecond Laser System to South Korea

Growing Demand for Femtosecond Laser Processing in Semiconductor Manufacturing

As semiconductor devices continue to become smaller, more integrated, and more complex, conventional machining technologies are increasingly challenged by hard and brittle materials such as silicon carbide (SiC), alumina (Al₂O₃), aluminum nitride (AlN), sapphire, and technical ceramics.

Traditional mechanical machining and thermal laser processing can introduce burrs, micro-cracks, recast layers, and heat-affected zones (HAZ), all of which may reduce component reliability and increase post-processing costs.

Femtosecond laser processing overcomes these challenges through an ultrafast cold ablation process. Because each laser pulse lasts only a few hundred femtoseconds, material is removed before significant heat can transfer into the surrounding area. The result is exceptional dimensional accuracy, superior edge quality, and virtually no thermal damage.

These characteristics make femtosecond lasers particularly well suited for manufacturing semiconductor components that require complex microfeatures and extremely tight tolerances.

A Customized Multi-Functional Platform for Precision Manufacturing

The exported system was engineered specifically for the customer's production requirements and combines multiple processing capabilities within a single platform.

The equipment supports:

• Precision micro drilling
• High-accuracy laser cutting
• Microstructure machining
• Surface texturing and precision patterning

Integrating multiple processes into one automated system simplifies production workflows while improving machining consistency across different operations.

Designed for high-volume precision manufacturing, the platform enables efficient processing of complex geometries and multilayer materials while maintaining excellent repeatability for high-volume production.

Advanced Micro Drilling with 5-Axis Helical Processing

One of the system's key capabilities is MONO's 5-Axis Helical Drilling technology.

Unlike conventional percussion laser drilling, helical drilling guides the laser beam along a controlled spiral path while synchronizing multi-axis motion. This approach significantly improves hole geometry, reduces taper, and produces cleaner sidewalls.

The technology is particularly suitable for semiconductor components requiring high-aspect-ratio micro holes, precision ceramic parts, probe card components, microfluidic structures, and other applications where hole quality directly affects product performance.

Combined with femtosecond laser cold ablation, the process produces burr-free micro holes with outstanding dimensional consistency while minimizing the need for secondary finishing operations.

Burr-Free Processing Improves Manufacturing Yield

For semiconductor manufacturers, machining quality directly influences production yield.

Components with burrs, edge chipping, or thermal damage often require additional deburring, polishing, or cleaning processes before assembly. These extra steps increase manufacturing costs while introducing additional process variability.

MONO's femtosecond laser systems produce clean cutting edges, high-quality microfeatures, and minimal heat-affected zones, allowing many components to proceed directly to inspection or downstream manufacturing.

The technology is capable of processing a wide range of advanced materials while achieving:

• Micron-level dimensional accuracy
• Minimal heat-affected zone (HAZ)
• Burr-free edge quality
• Excellent surface integrity
• High batch-to-batch consistency

These advantages help manufacturers improve production efficiency, increase yield, and reduce the total cost of precision component manufacturing.

(Semiconductor showerhead with hole diameter variation within 0.7 μm across nine measured points.)

Looking Ahead

The successful delivery of this custom femtosecond laser system to South Korea highlights how quickly ultrafast laser technology is gaining traction in the global semiconductor industry.

As chips keep pushing for smaller features, tighter tolerances, and greater consistency, femtosecond laser processing is fast becoming a must-have tool.

At MONO, we’ll continue partnering with customers around the world to create tailored laser solutions that help drive the future of precision manufacturing.

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