Visit MONO at Manufacturing World Tokyo 2026
Tokyo, Japan — July 2026
• How can manufacturers reduce burrs in micro holes?
• How can brittle ceramics be machined without edge chipping?
• How can ultra-thin materials be processed without thermal damage?
These are some of the manufacturing challenges that MONO will address at Manufacturing World Tokyo 2026.
From July 1 (Wed) to July 3 (Fri), 2026, MONO will exhibit at Tokyo Big Sight, East Exhibition Halls, Booth E28-55, showcasing real-world femtosecond laser micromachining applications and proprietary 5-Axis Helical Drilling technology.
Rather than displaying equipment alone, MONO will bring actual production samples, engineering data, and manufacturing expertise directly to Tokyo, allowing visitors to inspect sub-100 μm features and discuss challenging applications with our engineering team.
Why Visit MONO at Manufacturing World Tokyo 2026?
Visitors can:
- Inspect actual production samples.
- Evaluate features below 100 μm.
- Review microscopy images and processing data.
- Discuss manufacturing challenges with application engineers.
- Explore difficult materials and complex geometries.
- Submit drawings for technical evaluation.
Whether your challenge involves burr formation, taper control, ceramic edge chipping, or polymer carbonization, our team is available to discuss potential solutions.
The Core Technology: 5-Axis Helical Drilling
At the heart of MONO's manufacturing capability is proprietary 5-Axis Helical Drilling technology.
Unlike conventional percussion drilling, the laser beam follows a controlled orbital path, gradually removing material layer by layer. This enables exceptional control of hole geometry, surface quality, and dimensional consistency.
Key Capabilities
| Capability | Performance |
|---|---|
| Hole geometry | True circular morphology |
| Surface finish | Ra < 0.2 μm |
| Inner wall quality | Burr-free |
| Taper control | Low or engineered taper |
| Thermal influence | Negligible HAZ |
| Carbonization | Zero visible carbonization |
| Production consistency | High repeatability |
Applications on Display
Semiconductor and Probe Card Applications
Silicon Nitride (Si₃N₄) and advanced ceramic components demonstrate how femtosecond laser processing minimizes edge chipping and enables highly accurate micro-features.
Precision Flow Control Components
Filter elements, flow-control plates, and precision nozzles illustrate highly consistent micro-hole quality.
Refractory Metals
Tungsten and molybdenum applications demonstrate excellent dimensional control with minimal thermal influence.
Flexible Electronics
Ultra-thin Polyimide (PI) films processed through true cold ablation exhibit precise micro-features and zero visible carbonization.
Manufacturing Challenges and Solutions
| Manufacturing Challenge | Conventional Processes | MONO Solution |
|---|---|---|
| Burr formation | Common | Minimal burrs |
| Heat-affected zones | Significant | Negligible HAZ |
| Edge chipping | Frequent | Reduced chipping |
| Hole taper | Difficult to control | Controlled taper |
| Polymer carbonization | Common | Zero visible carbonization |
| Tool wear | Unavoidable | No tool wear |
| Process consistency | Variable | High repeatability |
Representative Applications
| Application | Material | Typical Challenge |
|---|---|---|
| Probe cards | Silicon Nitride (Si₃N₄) | Edge chipping |
| Flow control components | Stainless steel | Burrs and taper |
| Filter components | Metal alloys | Hole consistency |
| Refractory metals | Tungsten, molybdenum | Thermal influence |
| Flexible electronics | PI films | Carbonization |
Frequently Asked Questions
Q: How can burrs in micro holes be reduced?
A: Femtosecond laser processing minimizes thermal influence during material removal, significantly reducing burr formation.
Q: How can taper be controlled in micro drilling?
A: 5-Axis Helical Drilling enables low taper or engineered taper geometries through controlled orbital beam motion.
Q: Can Silicon Nitride be laser machined?
A: Yes. Femtosecond laser processing enables precise micro-features while reducing edge chipping.
Q: Can PI films be processed without carbonization?
A: Yes. True cold ablation enables precise processing of ultra-thin PI films with zero visible carbonization.
Q: What materials can be processed?
A: Typical materials include:
- Stainless steel
- Tungsten
- Molybdenum
- Technical ceramics
- Silicon Nitride
- Polyimide films
Exhibition Information
| Item | Information |
|---|---|
| Event | Manufacturing World Tokyo 2026 |
| Dates | July 1 (Wed) – July 3 (Fri), 2026 |
| Venue | Tokyo Big Sight, Japan |
| Hall | East Exhibition Halls |
| Booth | E28-55 |
| Company | MONO |
Submit Your Drawings for Evaluation
Manufacturers experiencing the following challenges are encouraged to contact MONO:
Our application engineers can review
- CAD drawings
- Technical requirements
- Existing components
- Failed samples
- Manufacturing challenges
Contact Our Engineering Team
Whether you plan to visit Manufacturing World Tokyo 2026 or discuss your project remotely, MONO engineers are available to evaluate processing feasibility, review CAD drawings, discuss manufacturing challenges, recommend suitable processing solutions, and provide technical support.