Solving Ceramic Chipping: MONO Showcases Femtosecond Laser Micromachining at IACE CHINA 2026
2026-03-26
On March 24th, the 18th China International Exhibition for Advanced Ceramics (IACE CHINA 2026) opened at the NECC (Shanghai). During the event, MONO showcased its cutting-edge femtosecond laser extreme manufacturing solutions, attracting significant attention from semiconductor and aerospace professionals. We effectively demonstrated how ultrafast lasers overcome the long-standing challenges of edge chipping, micro-cracks, and thermal damage in ceramic processing.
The Challenge of Ceramics
Advanced ceramics (Al₂O₃, AlN, SiC) are pillars of the semiconductor and aerospace industries. However, their extreme hardness and brittleness make edge chipping, micro-cracks, and thermal damage a recurring nightmare. For high-end components, these defects are the primary bottleneck hindering yield rates and product iteration.
MONO: Your Technical Partner for Extreme Manufacturing
MONO utilizes femtosecond laser "cold ablation" to bypass traditional physical limits. We offer a full-spectrum service model designed for high-precision industries:
R&D Feasibility Validation: Process matching and feasibility testing for new materials (e.g., GaN, SiC) and complex structures.
Precision Small-Batch Manufacturing: High-yield, mask-less manufacturing for prototypes and small batches without expensive tooling.
Turn-key Equipment Solutions: Customized femtosecond laser systems ready for mass production, with full lifecycle support.
Technical Advantages
Sub-micron Precision: Achieving R-angles < 3μm in square vias and zero-taper through-holes with ±1μm accuracy.
Surface Integrity: Ra < 0.2μm for superior airtightness and wear resistance—ideal for precision ceramic bearings and seals.
Advanced Applications: Including MEMS probe card substrates, semiconductor showerheads, and ceramic vacuum chucks.
Driving Advanced Packaging Trends
With the rapid evolution of advanced packaging (Fan-out, Chiplet), the demand for miniaturized and integrated ceramic components is surging. Femtosecond laser technology is becoming the industry standard. Whether for thinner ceramic interposers, high-integration substrates, or wafer processing tools, MONO’s cold ablation technology is the key to breaking manufacturing limits.
Struggling with low yields or complex ceramic micro-structures?
Contact us for a 1-on-1 technical consultation and feasibility assessment.
Contact us for a 1-on-1 technical consultation and feasibility assessment.