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Ceramics

2025-12-11
Unlike everyday ceramics like cups or bowls, industrial advanced ceramics boast higher raw material purity and special properties—high hardness, heat resistance, insulation, and thermal conductivity. Widely used in electronics, semiconductors, new energy vehicles, and aerospace, these hard-but-brittle materials are tough to machine. MONO’s femtosecond laser technology breaks this barrier, delivering high-precision micromachining services.
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Fs laser processing

Capabilities

Minimum through hole diameter: 20μm
Controllable taper: Positive, negative, near-zero
Irregular shaped microholes
3D curved surface microstructuring
Aspect ratio: 1:10 (near-zero taper through holes)
Smooth inner walls (≤Ra0.2μm)
No material chipping
No edge melting or microcracks
Precise depth control
Compatible with substrates up to 350×350mm
Material thickness ≤2mm
Minimal to no post-processing required

Precision Microholes & Connectors

Processing through holes in ceramic sheets with ±2μm accuracy. These high-precision microholes are widely used in ceramic ferrules, microfluidic chips, and sensor packaging.
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0.02mm SiC through holes
0.02mm SiC through holes
Zirconia nozzles
Zirconia nozzles
Zirconia square holes ±2μm accuracy
Zirconia square holes ±2μm accuracy
010203
Alumina ceramic sleeve etching (Ra≤0
20μm Fixed-Depth Helical Grooves on Ceramics
ePTFE Cutting
Alumina ceramic sleeve etching (Ra≤0
Si_N_ roller microstructuring
Si_N_ roller microstructuring
010203

Surface Microstructuring/Texturing

Femtosecond laser processes microgrooves, bumps, and pits on silicon carbide or silicon nitride surfaces to create functional surfaces (e.g., enhanced tribological properties).
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Advantages of Femtosecond Laser Ceramics Machining

✅ Thermal Damage-Free: Ultra-short pulses vaporize material directly, avoiding chipping or microcracks
✅ Wide Compatibility: Works with all advanced ceramics (no reliance on optical/electrical properties)
✅ Efficient & Cost-Saving: Fast custom response, minimal post-processing
✅ High Precision: Stable batch consistency, meeting high-end application requirements
fs-laser processing

End-to-End Services

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Contact information

Address

F1-F2, Building 4, Jianfa-Xinmei Industrial Park, No. 21 Gongtang Road, Guangming District, Shenzhen, China.

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