Inkjet & Filter Sieves Drilling

Both filtration devices and inkjet components rely on the ultimate precision of "holes"—the former for efficient separation, the latter for precise fluid control. Compared to micro-electroforming, or chemical etching, MONO’s femtosecond drilling technology utilizes non-contact "Cold Ablation" to produce parts with higher precision, greater density, and more complex geometries. We provide the solution for upgrading next-gen filters, micro-sieves, nozzles, and perforated foils.

micro-electroforming is typically restricted to a 1:2 aspect ratio, making it difficult to achieve small pore sizes while maintaining high pressure resistance. Furthermore, traditional methods cannot achieve high-density arrays in confined spaces.

Femtosecond lasers break these barriers as an advanced alternative.

❑ High Aspect Ratio: We can drill 10μm holes in 100μm thick foil (10:1 ratio).   This allows micro-sieves to withstand higher fluid pressures while maintaining high permeability.

❑ High Density & Durability: Thanks to the ultra-small spot size and heat-free processing, our hole density is 4x higher than traditional methods.   The stress-free edges significantly extend component lifespan.

❑ Micron Precision: Positioning accuracy within ±1μm, with hole diameters ranging from 3µm to 100µm.

To meet mass production demands, MONO employs advanced percussion drilling with high-speed scanning systems.   This solution is maturely applied to printer inkjet nozzles, polymer filtration membranes, and precision sieves.   We prioritize not just speed, but the quality of every single hole.