Laser Film Stripping

2025-12-10

Laser-Stripped Magnet PI Enameled Wires

Femtosecond Laser Film Stripping & Removal

Femtosecond laser film stripping is a precision, non-contact process that eliminates the risks associated with traditional mechanical stripping, such as substrate damage. By utilizing a tightly focused laser spot, it selectively removes various coatings—including polymer insulation and oxide layers—while leaving the underlying material pristine. This technology is essential for electronics, semiconductors, medical devices, and precision manufacturing.

Technical Advantages

Non-Contact & Non-Damaging: Eliminates mechanical wear and chemical contamination, ensuring the integrity of fragile substrates.

Micron-Level Precision: Achieves damage-free removal with etching precision of ≤±1 μm and depth control down to ≤0.1 μm.

Versatile Compatibility: Adapts to complex geometries (flat, tubular, and curved surfaces) and processes a wide range of materials, including metals, polymers, ceramics, and glass.

Efficient & Scalable: Highly stable and repeatable, making it ideal for both R&D prototyping and high-volume mass production.

Planar Film Removal (Flat Surfaces)

Precise stripping of coatings from flat substrates, ideal for high-precision electronic components and optical devices.

minimum line spacing of 3μm

Remove 1μm-thick gold coating on quartz glass

Remove gold coating on quartz glass

010203

Laser-Stripped Magnet PI Enameled Wires

Medical CGM sensors Remove polyimide coating on platinum-iridium (PtIr)

0102

Tube Coating Stripping

Specialized depth-controlled stripping for tubular devices, particularly in medical and electronic applications. The process accurately removes coatings to defined specifications with virtually no thermal impact on the underlying substrate.

Curved & Complex 3D Surfaces

Overcomes the field-stitching challenges of traditional processes, enabling seamless processing of curved surfaces. With stitching precision ≤±1 μm, it minimizes seam impact to ensure the functional integrity and electrical performance of microstructures.