Polymer
2025-12-11
Polymer Process
Polymer process
Polymers are core materials in medical, consumer electronics, precision instruments, and other fields—they’re light, corrosion-resistant, and have great insulation. polymers are highly heat-sensitive: traditional machining often causes heat-affected zones, warping, and carbonization. We use femtosecond laser tool to achieve unprecedented machining precision and surface quality.
Femtosecond laser’s thermal damage-free processing ensures the chemical stability and structural integrity of polymers, perfectly matching the high standards of medical devices:
PI Medical Catheter Drilling: Near-invisible HAZ, no opposite-wall damage, smooth hole walls, compliant with biocompatibility standards;
PDMS Cell Filter Membrane Hole Array Machining: Hole diameter 8.3μm±1μm, uniform hole distribution without deviation, no debris contamination—meets the core needs of cell filtration.
PDMS Cell Filter Hole Array Machining
PI Medical Catheter Drilling
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Conductive Fabric Contour Cutting
ePTFE Cutting
LED Phosphor Sheet Cutting
PCB Cutting
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Supports smaller, thinner, more flexible trend of consumer electronics with high-precision machining:
Glass Cloth Substrate PCB Cutting: Custom inner fillets, high-gloss cutting surfaces, no post-processing grinding—adapts to high-integration design;
ePTFE Flexible Component Cutting: Kerf width 0.046mm±1μm, no fiber fraying at edges, retains the material’s original flexibility;
Conductive Fabric Contour Cutting: Burr-free and carbonization-free, no damage to the conductive layer—ensures stable performance of flexible touch and wearable devices.
Micro-nano texturing endows materials with new functions, suitable for mass production scenarios such as injection molding:
PDMS Microneedle Array Etching: 3D microstructures (needle body + adjustable taper tip), dimensional accuracy ±1μm, array consistency >99%—meets medical scenarios like blood glucose microneedle patches;
PI Bump Structure Machining: Bump height 26μm±2μm, smooth surface—adapts to micro-texture manufacturing needs in flexible electronics and micro-sensors.
PDMS Microneedle Array Etching
PI Bump Structure Machining
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Femtosecond Laser: The Ideal Choice for Polymer Machining
Core Pain Points of Traditional Machining
Mechanical Machining: Prone to burrs and tearing; unable to achieve micro-nano scale precision structures;
Nanosecond/Picosecond Laser: Long pulse duration leads to heat diffusion, causing polymer melting, degradation, and discoloration;
Chemical Etching: High environmental risks; only suitable for simple contours; insufficient precision.
Core Advantages of Femtosecond Laser
✅ Near-Zero Thermal Impact (Cold Processing): Pulse width as short as 10⁻¹⁵ seconds; material vaporizes before heat conduction, no melting or warping—preserves the original performance of substrates;
✅ Ultra-High Precision & Controllability: Micron/nano-level machining accuracy, small dimensional errors, and strong consistency in mass production;
✅ Excellent Surface Quality: Neat edges, no burrs or carbonization, almost no post-processing required;
✅ Wide Compatibility: Works with all heat-sensitive polymers, regardless of material form or hardness; capable of machining complex 3D microstructures.
End-to-End Services
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Contact information
AddressF1-F2, Building 4, Jianfa-Xinmei Industrial Park, No. 21 Gongtang Road, Guangming District, Shenzhen, China.
- Email: laser_ops@szmono.cn
- WhatsApp/WeChat: +85256858560
