Silicon
2025-12-24
Silicon Laser Micromachining
Single Crystal Silicon is the foundation of ICs, CPUs, and high-end MEMS sensors. As a brittle material, Silicon is prone to chipping and micro-cracks under traditional machining stress. Unlike Deep Reactive Ion Etching (DRIE) which requires costly masks, our femtosecond laser technology is maskless and highly flexible.
Advantages
Using "cold ablation," we eliminate thermal stress, achieving sub-micron precision without damaging the material. This makes our solution ideal for silicon-based prototyping, feasibility studies, and small-batch customization.
✅ Sub-Micron Precision: Accuracy of ±1μm with surface roughness Ra ≤ 0.2μm.
✅ No Thermal Damage: Non-contact processing ensures chipping-free edges, no melting, and no micro-cracks.
✅ Simplified Process: Maskless operation requiring little to no post-processing.
✅ Capacity: Supports wafers up to 350×350mm with thickness ≤ 2mm.
Widely used for semiconductor heat sinks, MEMS vents, and TSV (Through-Silicon Via). We use spiral drilling and beam shaping for efficient energy transfer.
High Quality: Clean hole walls with no melting or recast layers.
High Aspect Ratio: Up to 1:10 for zero-taper holes.
Flexibility: Supports positive, negative, or zero tapers. Capable of drilling blind holes, through holes, and shaped holes (e.g., square).
fs-laser silicon microhole drilling
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Silicon Micro-Structure Forming
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Ideal for microfluidic channels, surface modification, alignment marks, and sensor features.
No Crystal Orientation Limits: Unlike chemical etching, our laser creates complex 2D and 3D structures regardless of crystal orientation.
Rapid Prototyping: Eliminates the need for photolithography masks, reducing costs and simplifying the process for MEMS development.
Controlled Depth: Creates smooth grooves (Ra ≤ 0.2μm) on both planar and curved surfaces in a single pass.
We provide "damage-free" dicing for small wafers and custom shapes.
Ultra-Thin Kerf: Minimum kerf width of just 3μm.
Cut Quality: Sharp edges with no burrs, no carbonization, and no discoloration.
Versatile Paths: Supports both straight lines and arbitrary curved cutting.
ps-laser (left) and fs-laser (right) — femtosecond laser delivers smooth cutting edges and no carbonization
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End-to-End Services
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Contact information
AddressF1-F2, Building 4, Jianfa-Xinmei Industrial Park, No. 21 Gongtang Road, Guangming District, Shenzhen, China.
- Email: laser_ops@szmono.cn
- WhatsApp/WeChat: +85256858560
